2017 Intern Technical Baltimore Hardware Engineering MD

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POST DATE 9/12/2016
END DATE 10/18/2016

DiversityWorking Baltimore, MD

Company
DiversityWorking
Job Classification
Full Time
Company Ref #
7285501
AJE Ref #
576152526
Location
Baltimore, MD
Job Type
Regular

JOB DESCRIPTION

APPLY
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* 2017 Intern Technical Baltimore \(Hardware Engineering\)\- MD
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* Requisition ID:
16021235
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* Location\(s\):
United States\-Maryland\-Baltimore
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* US Citizenship Required for this Position:

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* Relocation Assistance:
Relocation assistance may be available
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* Travel:

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* This position description does not represent a current opening _but may be used_ to identify candidates with skills and experience for positions within Northrop Grumman that frequently become available\. Candidates who express an interest may be considered for future positions at Northrop Grumman\.Your opportunities for achievement are limitless with Northrop Grumman Mission Systems\.An internship at Northrop Grumman is unique\. Sure, you'll learn new skills, explore our enterprise, network with experts, connect with thought leaders, and finish with a resume that opens doors\. But you'll gain something even more valuable:
pride in what you've done\. Join us and launch your career\. We'll support you with training, employee resource groups, and our shared vision of global security\.
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* Northrop Grumman is seeking Hardware Engineers for an internship opportunity\.
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* These positions will be located at our Mission Systems Sector in
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* Maryland \(specific location may be in Annapolis, Baltimore, or Sykesville\)\.
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* The qualified candidate will become part of Northrop Grumman's Electronics or Mechanical/Hardware Engineering organization and will work in a dynamic people\-focused environment where he/she will interact with users, customers and other developers\.
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* Roles and Responsibilities
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* Assignments tend to be hardware engineering\-oriented and may involve:
+ Antenna systems engineering, antenna integration & test, antenna control, antenna beam steering control+ Test equipment design engineering+ RF/Microwave devices & packaging technology \(MMIC/RFIC design, module/tile design, control & test data\), RF/microwave component design & test+ Electromagnetic simulation/analysis+ Digital & mixed signal circuit card assembly design, application specific integrated circuit \(ASIC\) design, digital & mixed signal subsystem design, digital signal processing, real\-time sensor control product design+ Power conditioning technology \(power supplies, variable speed drives, frequency converters, multi\-level converters\)+ Power conversion technology \(power electronics, electro\-optical/infrared systems\)+ Signal conversion technology \(architecture, receivers, exciters, array drivers, integration & test, space electronics\)+ Solid state/microelectronics device design+ Support new product design and development engineering for antenna architecture development, space sensors, digital/analog/power/RF module packaging, large platform design and integration, underwater sensor and vehicle design, structural design and analysis, thermal design and analysis, and electro\-optical design+ Manufacturing support and follow+ Drafting oversight and drawing creation+ Produce 3\-D CAD models
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* Basic Qualifications:

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* A candidate, regardless of age and hiring source, must meet ALL of the below criteria\. The candidate must:

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* + Be a student who is enrolled full\-time and pursuing an undergraduate or graduate degree from an accredited college/university+ Be majoring in Electrical Engineering, Computer Engineering, Electrical and Computer Engineering, Mechanical Engineering, Applied/Engineering Physics, or Microelectronics Engineering+ Have an overall cumulative GPA of 3\.25/4\.0 or higher \(unofficial academic transcripts must be provided at time of application by uploading the documents to your application or profile\)+ Be available to work full\-time \(40 hours per week\) for at least 10 weeks during summer 2017+ Be able to obtain a U\.S\. Government security clearance \(U\.S\. citizenship is a pre\-requisite\)
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* Preferred Qualifications:

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* + Have an overall cumulative GPA of 3\.70/4\.0 or higher+ Previous internship/co\-op experience, leadership & teamwork capabilities, interpersonal communication skills, and activities \(professional/community/extracurricular\)+ Good presentation and writing/communication skills+ Self\-motivated, willing to learn, and interested in working in a team environmentNorthrop Grumman is committed to hiring and retaining a diverse workforce\. We are proud to be an Equal Opportunity/Affirmative Action\-Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class\. For a complete EEO/AA and Pay Transparency statement, please visit www\.northropgrumman\.com/EEO U\.S\. Citizenship is required for most positions\.
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* Title:

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* _2017 Intern Technical Baltimore \(Hardware Engineering\)\- MD_
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* Location:

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* _Maryland\-Baltimore_
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* Requisition ID:

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* _16021235_ .