Failure Analysis Engineer

Performing subsequent examination of the cause or causes of failure on failed components/parts using analytical laboratory techniques.
Responsibilities include: sample preparation, cross-sectioning, chemical de-capsulation of electronic devices etc, perform component level failure analysis for internal and external customers, interpretation and communication of analysis data from performed test. Coordination with internal and external engineering teams involved in product support and generation of written FA reports. This role requires strong knowledge in materials behavior, characterization, failure modes, and degradation mechanisms as well as duplication of failure modes. Familiarity with the following materials is desirable- Metals and alloys (solder and soldering products), polymers, composites, coatings, adhesives. Experiences with SEM, FTIR, IC tester, CMM, TDR and other Part lab instruments are required. Coordinate troubleshooting of the electronics to the component level and electrical failure characterization.
Perform detail-oriented, timeline driven work with extreme accuracy.
Familiarity with industry standards IPC-TM-650 , IPC/J STD is a must.

Requirements
BS/MS EE/ME/Material Science or other related engineering discipline with 5-7 years experience and hands-on failure analysis of electronic and mechanical components. Must be skilled at sample preparation, cross-sectioning, polarized light microscopy and x-ray analysis. Chemical de-capsulation of electronic devices and hands-on experience with SEM, EDS, FTIR, C-SAM, TDR required. Ability to work well in a fast-paced professional environment.
Strong verbal and written communication skills including technical report writing and presentations.

***m01/26/2012