Semiconductor CMP and Backgrind Equipment Engineer

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POST DATE 9/14/2016
END DATE 3/17/2017

Broadcom Limited Fort Collins, CO

Company
Broadcom Limited
Job Classification
Full Time
Company Ref #
R001343
Location
Fort Collins, CO
Experience
Mid-Career (2 - 15 years)
Job Type
Regular
Education
Bachelors Degree
AJE Ref #
576171666

JOB DESCRIPTION

JOB DESCRIPTION:

As a CMP and Backgrind Equipment Engineer with Broadcom Limited s Wireless Semiconductor Division (WSD), you will own and support equipment used to develop and manufacture advanced processes in our state of the art 8 high performance wireless products wafer fabrication facility located along the Front Range Mountains in Northern Colorado.

You will team with Technology Development, Process Engineering and the Equipment Maintenance (owns day to day tool support) groups to achieve this objective. This team will be challenged to deliver new materials, applications and device architectures. You will be responsible for establishing robust equipment operation and maintenance plan through rigorous characterization and statistical validation before releasing tools into high volume manufacturing, and leading support team after release.

Fabrication technologies include silicon based MEMS and compound semiconductor RF devices. Primary focus will be on CMP (Chem-Mechanical), back grinding, and wafer scrubbing equipment within the Finish Equipment Engineering group. This group owns a much more diverse equipment set which will offer the candidate exposure and opportunities beyond CMP/grind/scrub tool set, including advanced laser dicing, wafer bonding (permanent and temporary), wafer edge trimming, automated vacuum film lamination, UV cure and film removal tools to name a few.

RESPONSIBILITIES
Technical leadership in identifying, evaluating, improving and maintaining equipment.
New equipment selection, acceptance and start-up as well as optimization; conferring with equipment vendors and manufacturing engineers at Avago.
Support existing equipment upgrades with qualification support.
Develop and implement preventative, predictive and high precision maintenance procedures. Implementation includes documenting procedures, assisting in training and certifying personnel.
Work with peers and the unit Process Engineering/Equipment Maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals.
Collaborate with Process Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality, cost and productivity goals; ownership of related metrics.
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, base lining & matching).

JOB QUALIFICATIONS
BS in Physics, ME, ChemE, Materials Science, MechatronicsE, and a minimum of 2 years of experience as an engineer supporting CMP or Backgrind equipment in a MEMS/semiconductor HVM environment.
AMAT Mirra polisher, or Disco die saw or back grind tool experience is a plus.
Detail oriented with strong fundamentals in core equipment engineering functions.
Excellent diagnostic and troubleshooting skills for process/equipment interactions.
Practical experience applying structured problem solving methods.
Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing.
Mature data analysis skills using SW tools such as JMP, Minitab, Spotfire and Excel/Access, and ability to script when needed.
Excellent verbal and written skills. Commitment to effective communication.
Initiative to address and appropriately escalate problems to achieve rapid resolution.
Desire candidate to have experience in Fault Detection & Classification (FDC) systems, Copy Exact (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean manufacturing.
Basic understanding of MEMS and active device micro-fabrication techniques is highly desirable.

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ALL QUALIFIED APPLICANTS WILL RECEIVE CONSIDERATION FOR EMPLOYMENT WITHOUT REGARD TO RACE, COLOR, RELIGION, SEX, SEXUAL ORIENTATION, GENDER IDENTITY, NATIONAL ORIGIN, CITIZENSHIP, DISABILITY OR PROTECTED VETERAN STATUS.

JOB DESCRIPTION:

As a CMP and Backgrind Equipment Engineer with Broadcom Limited s Wireless Semiconductor Division (WSD), you will own and support equipment used to develop and manufacture advanced processes in our state of the art 8 high performance wireless products wafer fabrication facility located along the Front Range Mountains in Northern Colorado.

You will team with Technology Development, Process Engineering and the Equipment Maintenance (owns day to day tool support) groups to achieve this objective. This team will be challenged to deliver new materials, applications and device architectures. You will be responsible for establishing robust equipment operation and maintenance plan through rigorous characterization and statistical validation before releasing tools into high volume manufacturing, and leading support team after release.

Fabrication technologies include silicon based MEMS and compound semiconductor RF devices. Primary focus will be on CMP (Chem-Mechanical), back grinding, and wafer scrubbing equipment within the Finish Equipment Engineering group. This group owns a much more diverse equipment set which will offer the candidate exposure and opportunities beyond CMP/grind/scrub tool set, including advanced laser dicing, wafer bonding (permanent and temporary), wafer edge trimming, automated vacuum film lamination, UV cure and film removal tools to name a few.

RESPONSIBILITIES
Technical leadership in identifying, evaluating, improving and maintaining equipment.
New equipment selection, acceptance and start-up as well as optimization; conferring with equipment vendors and manufacturing engineers at Avago.
Support existing equipment upgrades with qualification support.
Develop and implement preventative, predictive and high precision maintenance procedures. Implementation includes documenting procedures, assisting in training and certifying personnel.
Work with peers and the unit Process Engineering/Equipment Maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals.
Collaborate with Process Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality, cost and productivity goals; ownership of related metrics.
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, base lining & matching).

JOB QUALIFICATIONS
BS in Physics, ME, ChemE, Materials Science, MechatronicsE, and a minimum of 2 years of experience as an engineer supporting CMP or Backgrind equipment in a MEMS/semiconductor HVM environment.
AMAT Mirra polisher, or Disco die saw or back grind tool experience is a plus.
Detail oriented with strong fundamentals in core equipment engineering functions.
Excellent diagnostic and troubleshooting skills for process/equipment interactions.
Practical experience applying structured problem solving methods.
Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing.