Milling & Implant Equipment Engineer 9/14/2016
Fort Collins, CO
JOB DESCRIPTIONAPPLY JOB DESCRIPTION:
As a Milling & Implant Equipment Engineer with Broadcom Limited s Wireless Semiconductor Division (WSD), you will own and support equipment used to develop advanced processes in our state of the art 6 wafer fabrication facility located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Process Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. Fabrication technologies will include silicon based MEMS and compound semiconductor active devices. Primary focus will be on Milling & Implant equipment.
Provide technical leadership in identifying, evaluating, improving and maintaining equipment.
New equipment selection, acceptance and start-up as well as optimization; conferring with equipment vendors and manufacturing engineers at Avago.
Existing equipment upgrade and 6 8 tool conversion with qualification support.
Develop and implement preventative, predictive and high precision maintenance procedures. Implementation includes documenting procedures, as well as training and certifying personnel.
Work with peers and the unit process engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals.
Collaborate with Process Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality, cost and productivity goals; ownership of related metrics.
Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).
BS in EE, ME, ChemE, Materials Science and a minimum of 5 years of experience as an engineer supporting Milling or Implant equipment in a MEMS/semiconductor HVM environment.
Meyer Burger Trim Tools, AVP/Veeco Ion Mills, or Purion Implanter experience is a strong plus.
Detail oriented with strong fundamentals in core equipment engineering functions.
Excellent diagnostic and troubleshooting skills for process/equipment interactions.
Practical experience applying structured problem solving methods.
Working knowledge and practical experience with SPC, DOE and statistical hypothesis testing.
Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access.
Excellent verbal and written skills. Commitment to effective communication.
Initiative to address and appropriately escalate problems to achieve rapid resolution.
Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
Basic understanding of MEMS and active device micro-fabrication techniques is highly desirable.
IF YOU ARE LOCATED OUTSIDE USA, PLEASE BE SURE TO FILL OUT A HOME ADDRESS AS THIS WILL BE USED FOR FUTURE CORRESPONDENCE.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability or protected veteran status.