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POST DATE 8/18/2016
END DATE 12/19/2016
MJM Global Search, Inc.
JOB DESCRIPTIONPOSITION: Semiconductor Engineer
LOCATION: Midwest, paid relocation
DESCRIPTION: Identify, evaluate and implement changes to enhance the performance and quality of wafer level packaged devices; provide engineering and support for packaging development and production operations. Implement Chip Scale Packaging technology, and expand the technology for future product growth. Perform revisions, improve yield success ratio and reduce manufacturing cost and test times. Provide manufacturing support.
REQUIIREMENTS: BSEE with at least 5 years of semiconductor electrical engineering experience; a thorough understanding of the principals involved in semiconductor wafer processing. Experience with problem solving methodologies - DOE, 8D or PDCA. Strong understanding of semiconductor production regarding Test and Process Chip Scale Packaging. Excellent communication skills with a strong desire to drive change and ability to work in a team environment.
KEYWORDS: Packaging development engineer, wafer level packaged device, semiconductor, electrical engineering, manufacturing, chip scale packaging, CSP, semiconductor wafer processing, BS, MS, BSEE, DOE, 8D, PDCA, Midwest.