We re passionate about innovating technology that will lead advanced wafer level packaging and 3D integration. At TEL NEXX, Inc., our team is determined to meet the electrochemical deposition (ECD) and physical vapor deposition (PVD) challenges of the most demanding semiconductor manufacturers. We are committed to offering the lowest cost of ownership, the greatest development flexibility and highest extendibility to future applications in both back-end and front-end processes. We believe each new member of our team should strengthen the excellence of the whole team, our technology and most importantly, our customers experience.
The test engineer will be a member of team producing and developing an array of deposition tools that push the envelope for wafer level packaging. You will work with mechanical engineers, controls engineers, and software engineers in the testing and performance validation of process modules and motion control systems. This position is not expected to support chip level testing and will entail very little PCB testing.
Develop test plans for system and sub-systems using FMEA and other techniques
Release test plans and associated work instructions using the engineering change management process
Test and troubleshoot complex semiconductor capital equipment and sub-systems
Perform mechanical, electrical, and fluid flow tests to verify system performance
Collect, organize and analyze test data
Propose system improvements to problems identified during testing
Use high-level compiled software for control, test and analysis
Design, build, document, and release to production test equipment and fixtures
Train other employees on using the test procedures and equipment
BS or MS in Electrical Engineering and/or Computer Science with solid experience with troubleshooting and developing electrical schematics
minimum 2 years of relevant experience working with complex electro-mechanical equipment including pneumatic actuators, motors, encoders, and switches
Familiarity with motion and process control devices such as controllers and amplifiers including device-level programming
Familiarity with Excel, Word, and solid modeling software
Familiarity with one or several of PLC, EtherCAT, TwinCAT, Labview is a big plus
Job duties are often performed in confined areas in a clean room environment, in awkward positions and/or in high places. Mechanical aptitude, manual dexterity and ability to lift/carry objects up to 35 pounds is required. May require bending/stooping/crawling/climbing. May require the use of Personal Protection equipment and proper industry safety procedures when working with one or more dangerous element or conditions such as chemicals, electric currents or high voltage, moving mechanical parts, radiation, etc. Occasional overnight travel to TEL factory, training facilities and customer locations may be required.
Equal Opportunity Employer/Minorities/Females/Disabled/Veterans
Tokyo Electron is an Equal Employment Opportunity Employer.