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Wire Bonder Technician

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POST DATE 9/3/2016
END DATE 10/29/2016

Lawrence Berkeley National Laboratory Berkeley, CA

Berkeley, CA
AJE Ref #
Job Classification
Full Time
Job Type
Company Ref #
Entry Level (0 - 2 years)
High School Diploma or GED


Berkeley Lab is Bringing Science Solutions to the World, and YOU can be a part of it!

In the world of science, Lawrence Berkeley National Laboratory (LBNL) is synonymous with "excellence." That's why we hire the best - whether in research, science or operations. This is a great opportunity to bring your top-notch skills to bear in support of world-class scientific research that addresses national and global challenges!

Position Summary:

Berkeley Labs Engineering Division has an opening for a Wire Bonder Technician to provide a wide range of technical support on multiple projects in an R&D laboratory environment. Functioning at the level of an expert operator of wire bonding and related microelectronics process equipment, you must be able to interact with and advise engineers and physicists, and train non-expert operators on specific tasks, while carrying out precision microelectronic assembly work and provide input to new designs.

Specific Responsibilities:


Program, setup, operate, troubleshoot and train other personnel on operation of wire bonding equipment.

Perform assembly or modification tasks on hybrid microcircuits and sub-assemblies, including wire bonding under conditions such as small pad sizes down to 50um, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Troubleshoot defective hybrids by visual screening, wire bond pull tests, or other methods.

Interact with engineers, designers and electronics coordinators on matters relating to finished product design, technical performance and documentation criteria. Provide input to cost estimates and production/installation scheduling.

Interpret generalized written or verbal instructions from engineers and physicists. Select appropriate components, packaging enclosures and manufacturing techniques and procedures. Follow appropriate codes and standards associated with the trade.

Operate process equipment related to wire bonding and general technical support for silicon wafer detector development.

Read and interpret schematics, sketches, parts list, and component layout diagrams.

Communicate with vendors in the procurement of supplies and equipment and for arranging service of existing equipment as needed.

Additional Desired Responsibilities:


Fabricate and/or install complex electronics hardware including chassis, instruments, printed circuit boards, cables, wiring harnesses, equipment racks and consoles, and control and instrumentation cross-connect / inter-connect cabling systems.

Provide on-the-job training to lower level or less experienced staff on matters relating to design layout, fabrication and installation techniques and procedures, and quality and workmanship codes and standards.

Required Qualifications:


Substantial work experience with wire bonding, wire bonding techniques, procedures, testing and quality standards.

Ability to work under a microscope on precision, delicate and/or ESD-sensitive assemblies and components.


Proficiency with personal computers, having application skills with spreadsheets database and word processors.

Substantial technical understanding of electronics fabrication and installation techniques, procedures, codes and quality standards.

Successful track record of accomplishments with only general guidance and limited supervision.

Skill in performing design layouts requiring general measurements and calculations.

Competency in reading and correctly interpreting schematics, sketches, parts lists, and component layout diagrams.

Color vision sufficient to discern wiring and component color codes, and safety related colored signs, lamps and warning devices.

Additional Desired Qualifications:


High school/trade school/college courses in tool usage, soldering, blueprint/schematic reading, and general AC and DC circuit theory.

Experience in fabricating and installing the full spectrum of general electronics hardware and systems. Substantial technical understanding of electronics fabrication and installation techniques, procedures, codes and quality standards.

Knowledge of and ability to use appropriate hand power and machine tools of the trade.

General electronics drafting and design-documentation skills.

Ability to climb stairs and ladders, work from heights and confined spaces, and lift 23 kg (50 lbs.).

The posting shall remain open until the position is filled, however for full consideration, please apply by close of business on November 19, 2016.



This is a career appointment.

Incumbents in this position are represented by a union for collective bargaining purposes.

Salary will be predetermined based on range determined by collective bargaining agreement.

This position requires completion of a background check.

Berkeley Lab addresses the worlds most urgent scientific challenges by advancing sustainable energy, protecting human health, creating new materials, and revealing the origin and fate of the universe. Founded in 1931, Berkeley Labs scientific expertise has been recognized with 13 Nobel prizes. The University of California manages Berkeley Lab for the U.S. Department of Energys Office of Science.

Equal Employment Opportunity: Berkeley Lab is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, age, or protected veteran status. Berkeley Lab is in compliance with the Pay Transparency Nondiscrimination Provision under 41 CFR 60-1.4. Click here to view the poster and supplement: "Equal Employment Opportunity is the Law.