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POST DATE 10/11/2017
END DATE 1/30/2018
JOB DESCRIPTIONWill support engineering activites for process developen with PECVD dielectric film deposition tools. This job requires accuate program and recipe editing and loading to deposit required films on silicon wafers. The positions requires working from written and verbal insturctions to prepare and process wafers iwth the correct films with careful attention to detail. Data collection and collation from a variety of thin film metrology tools is required including film thickness, film stress, in film defects, leakage current and resistance. The candidate must be able to make judgements about tool qualification based on the metrology data and write completed and accurate detailed passdowns to communicate with process engineers. Must be able to carry up to 30 pounds rtouinly during their shift.
Required Skills / Qualifications: 3 years wafer processing. 3 years expeirnce with MS Office including Word and Excel.
Preferred Skills / Qualifications:
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