Solution Architect, Labels

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POST DATE 9/12/2016
END DATE 10/18/2016

DiversityWorking

Company
DiversityWorking
Job Classification
Full Time
Company Ref #
7289304
AJE Ref #
576154877
Job Type
Regular

JOB DESCRIPTION

APPLY
Available work locations near a major transportation hub preference to US Western Region and will require a minimum of 75% travel to support the customers:
- Atlanta - Chicago - Dallas, TX - Los Angeles, CA - New York area - San Francisco - Any major city in the US with a major airportJob description:This position will report to the Business Segment Manager, Labels. The Solution Architect is focused on bringing End to End (E2E) solutions to the market with a specialty or background in Label finishing. In this role, you will have the opportunity to shape HP Indigo Digital Press Solutions to label and packaging customers. A key component of this role is to serve as the dedicated Pre-Sales Solution Architect for the Label and Packaging Segment. Strong technical expertise in Label and Packaging segments.The role is customer facing, and is directly engaged with the sales team for the Label and Packaging Segment with up to 75% travel.Areas of Responsibilities:* Provide full Solution Architect (SA) Field support for the Label and Packaging Segment.* Focused on the Label and Packaging Segment, and be the expert around End to End (E2E) solutions for that segment* Work with the Product Managers, GBU (Global Business Unit) Segment Leads, Solution Partners (coordinated with Solution Partner Manager) and Business Development team to 'Package' E2E solutions for Label and Packaging Segment* Define E2E solution needs and recommend the right Solution Partner* Keep segment focused specialization and support/enable cross segment overflow support (peak season etc.)Education, Skills and Experience Bachelor's degree in Technical discipline or Business, Sales or Marketing or other non-technical degree or equivalent combination of education and experience. Looking for 5-10 years of sales, sales support experience and demonstrated success in Label and Packaging Segment. Experience Includes:
Inner deep understanding of Labels and Packaging market segments. Needs high level of Technical Expertise in Digital Press solution implementation Understanding of Conventional Label and Packaging Equipment Pre-sales experience managing complex workflow and finishing solutions Product Marketing Management a plus Go To Market and experience to package solution offerings Delivering value proposition to customers/prospects Additional skills Knowledge of network, computer skills, web research for company detail Experience in consulting and selling tangible and intangible technical solutions Exceptional communication skills Good initiative Good judgment Flexibility End-user customer sales Strategic Selling experience Technical assistance within selling process Product demonstration Communication of specific sales plans Working with external partners to deliver solution sales Interface with all levels in customer organization Coordination or team leading with other sales professionals Project management Business Plan development Cross-functional selling ability*
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* Sales
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* Title:

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* Solution Architect, Labels
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* Location:

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* United States
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* Requisition ID:

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* 1501899
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* Other Locations:

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* United States-Illinois-Chicago, United States-California-San Francisco, United States-Texas-Dallas, United States-Georgia-Atlanta, United States-New York-New York, United States-Michigan-Detroit
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