Failure Analysis Engineer

Perform analyses on ON Semiconductor integrated circuits in order to determine the failure mechanism of products which have been returned by external customers or failed during internal qualifications/evaluations or during new product design. Wide variety of IC's including complex ASICs, Analog, Mixed Signal, Digital Logic, Filters, and Smart Discretes. Failure analysis activities include electrical bench verification and characterization of failures, non-destructive analysis (such as X-Ray, acoustic analysis, package inspection), topside and backside decapsulation, layer by layer removal using wet and dry etching, and the use of analytical techniques such as photoemission microscopy, OBIRCH, DALS, SEM techniques, FIB, sample prep, die node probing, circuit analysis and wet/dry delayering. The analyst is responsible for the generation of high quality Product Analysis Reports which incorporate images and effectively communicate to the reader the analysis steps taken during the course of the analysis. The report should clearly explain how the failure mechanism found relates to the product's electrical failing mode. This position also involves completing projects and tasks related to lab development and maintenance activities. Position Requirements Detailed understanding of semiconductor physics, MOS and bipolar junction transistor theory of operation, and a detailed transistor-level understanding of a variety of analog and logic circuits required. MSEE preferred (BSEE at minimum). Experience in failure analysis is desired. The candidate must excel at multi-tasking, working in a team environment and have good problem solving skills. Position involves working with chemicals (acids, solvents) and small samples.